AGENT AND METHOD FOR TREATING COPPER SURFACE

摘要

Disclosed is an agent for treating a copper surface, which is capable of processing the copper surface into a flat and smooth surface without increasing the number of processing steps and without subjecting the copper surface to a roughening treatment such as etching.  The agent for treating a copper surface is also capable of maintaining adhesion between copper and an insulating material such as a resin.  A method for treating a copper surface is also disclosed.  The agent for treating a copper surface contains a tin compound, a complexing agent and a water-soluble or water-dispersible polymer.  The water-soluble or water-dispersible polymer has at least one kind of functional group which is selected from the group consisting of an amino group, an epoxy group, a thiol group, a carboxyl group, a sulfonic acid group, a hydroxyl group, a phosphoric acid group, an imino group and a silanol group.