| 发明名称 |
SHEET FOR SEMICONDUCTOR PROCESSING |
| 摘要 |
A semiconductor processing sheet, the sheet comprising a base material and a pressure sensitive adhesive layer laminated on at least one surface of the base material, the pressure sensitive adhesive layer being formed of a pressure sensitive adhesive composition, the pressure sensitive adhesive composition containing a polymer having a salt and an energy ray curable group and an energy ray curable pressure sensitive adhesive component (excluding the above polymer). The semiconductor processing sheet can suppress contamination of an adherent at the time of peeling after energy ray irradiation while exhibiting a sufficient antistatic property. |
| 申请公布号 |
US2016211163(A1) |
申请公布日期 |
2016.07.21 |
| 申请号 |
US201414914358 |
申请日期 |
2014.08.29 |
| 申请人 |
LINTEC CORPORATION |
发明人 |
YAMASHITA Shigeyuki;SATO Akinori |
| 分类号 |
H01L21/683;C09J7/02 |
主分类号 |
H01L21/683 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor processing sheet, the sheet comprising a base material and a pressure sensitive adhesive layer laminated on at least one surface of the base material,
the pressure sensitive adhesive layer being formed of a pressure sensitive adhesive composition, the pressure sensitive adhesive composition containing a polymer having a salt and an energy ray curable group and an energy ray curable pressure sensitive adhesive component (excluding the polymer). |
| 地址 |
Tokyo JP |
