发明名称 プリント板、プリント板実装構造、およびプリント板実装方法
摘要 A printed circuit board on which a surface mount electronic device is mounted. The printed circuit board includes a substrate on which land arrangements are disposed in an array. Each land arrangement includes a core portion and drawing portions. The drawings are disposed along diagonal directions relative to the core portions of the array of the land arrangements.
申请公布号 JP5649788(B2) 申请公布日期 2015.01.07
申请号 JP20090011233 申请日期 2009.01.21
申请人 富士通株式会社 发明人 安陪 光紀;福田 孝
分类号 H05K3/34 主分类号 H05K3/34
代理机构 代理人
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