SUBSTRATE-PROCESSING APPARATUS, HEATER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

[Problem] To decrease the temperature stabilization time inside a processing furnace. [Solution] The present invention has a substrate-holding tool for holding a substrate, a processing chamber for processing the substrate held in the substrate holding tool, a first heater for heating the interior of the processing furnace from outside the processing chamber, and a second heater disposed so as to be positioned inside the substrate-holding tool, for heating the substrate from the back-surface side of the substrate. The second heater is provided with: a support-column part; an annular part connected to the support-column part, the annular part being formed in an arc shape having a diameter than is smaller than the diameter of the substrate; a pair of connection parts for connecting each end of the annular part to the support-column part; and a heating element provided in the interior of the annular part.