| 摘要 |
The present invention relates to a wafer bonding apparatus and a wafer bonding method using the same, in which a first bonding film body where a first protecting film and a second protecting film are adhered on both sides of a bonding film is half-cut to cut the first protecting film and the bonding film corresponding to a shape of a carrier wafer, a portion except a portion corresponding to the carrier wafer of the bonding film and a portion corresponding to the carrier wafer of the first protecting film are removed from the first bonding film body half-cut by a half-cutting device to form a second bonding film body, and the first protecting film is removed from the second bonding film body being passed through a first film remover to form a third bonding film body and the third bonding film body is bonded to the carrier wafer within a chamber, thereby continuously performing a process of vacuum-bonding the bonding film to the carrier water via one line to enhance productivity, and precisely cutting the bonding film body to a size of the carrier wafer for easily bonding the bonding film body compatibly to the carrier wafer and easily separating the protecting film to enhance convenience in a bonding process and to reduce bad quality rate of the bonding process. |
