| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for polishing a sapphire wafer outer periphery which is easy to perform cleaning, low in environmental load, and allows more than one wafer to be processed at a time according to the geometry of each outer peripheral surface.SOLUTION: A method for polishing a sapphire wafer outer periphery comprises: a wafer-stacking step which includes stacking and fixing sapphire wafers (2) identical in outer diameter to coincide with each another without deviation and to avoid exposure of flat end faces (2a, 2b); a shot-blast step which includes polishing outer peripheral surfaces (2c) of the sapphire wafers stacked, fixed and thus united after the wafer-stacking step by shot-blast treatment; and a separation step which includes separating the stacked sapphire wafers into individual sapphire wafers after the shot-blast step. The shot-blast step uses an elastic polishing material (10) including a mixture of an elastic material (12) and a polishing material (14). |
