| 摘要 |
Disclosed is a heat dissipation device for an optical module. The device comprises: a printed circuit board (PCB) (3) for arranging an optical module (1); a radiator (2) mounted at an upper end of the optical module (1); and a lining assembly arranged below the PCB board (3) and used for increasing heat dissipation of the optical module (1), wherein a position of the PCB board (3) corresponding to the optical module (1) is provided with through holes (30, 33), and the through holes (30, 33) and the lining assembly constitute an additional heat dissipation structure used for increasing the heat dissipation of the optical module. A heat dissipation device for an optical module of the present application can enlarge a heat dissipation area of a radiator on an upper surface of the optical module, or use a lower surface or lining of the optical module for heat dissipation optimization, thereby improving the heat dissipation efficiency of an optical film. |
