METHOD FOR MANUFACTURING AN ELECTRONIC CIRCUIT DEVICE AND ELECTRONIC CIRCUIT DEVICE

摘要

A method for fabricating an electronic circuit device is provided to reduce position mismatch between the center of a chip electrode and the center of a connection bump by continuously forming the connection bump and a recognition bump by a wire-bonding process and by using the recognition bump as a recognition pattern for determining the mounting position of a circuit device. An electrode is formed on the main surface of a circuit device(10). A connection bump electrode(2) and a recognition bump electrode(3) are formed on the main surface of a substrate(1). A connection bump(12) and a recognition bump(13) are continuously formed in the connection bump electrode and the recognition bump electrode by a wire-bonding process, respectively. The position of the recognition bump is detected based upon the image of the recognition bump taken by an optical unit(30). The circuit device is attached to the substrate through the connection bump based upon the position of the recognition bump.