| 摘要 |
An optical semiconductor device includes a semiconductor chip, leads electrically connected to the semiconductor chip, and a package through which the leads are projected. In a manufacturing method, a lead frame is formed to have leads and hanging leads that reach the package of the optical semiconductor device. Then, only the leads are cut from the lead frame to form a support frame where the hanging leads support a plurality of the optical semiconductor devices. During the manufacturing process after the support frame is formed, only the support frame is contacted. Therefore, the optical semiconductor devices are processed in a non-contact state during the manufacturing process. |
