STACKED WAFER OR DIE PACKAGING WITH ENHANCED THERMAL AND DEVICE PERFORMANCE
摘要
Some embodiments of the present invention include apparatuses and methods relating to stacked wafer or die packaging with enhanced thermal and device performance.
申请公布号
WO2007050754(A2)
申请公布日期
2007.05.03
申请号
WO2006US41779
申请日期
2006.10.24
申请人
INTEL CORPORATION;BASKARAN, RAJASHREE;RAMANATHAN, SHRIRAM;MORROW, PATRICK
发明人
BASKARAN, RAJASHREE;RAMANATHAN, SHRIRAM;MORROW, PATRICK
