发明名称 |
Semiconductor package having a semiconductor chip in a substrate and method of fabricating the same |
摘要 |
Example embodiments relate to a semiconductor package having a semiconductor chip provided in a substrate and a method of fabricating the same. The semiconductor package may include a semiconductor substrate having a first through hole and a plurality of second through holes spaced apart from the first through hole. A semiconductor chip having a plurality of pads may be disposed in the first through hole. Solder balls electrically connected to the pads may be attached to end portions of the second through holes. A plurality of the above semiconductor substrates may be stacked to form a multi-chip package.
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申请公布号 |
US2008169548(A1) |
申请公布日期 |
2008.07.17 |
申请号 |
US20070000377 |
申请日期 |
2007.12.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD |
发明人 |
BAEK HYUNG-GIL |
分类号 |
H01L23/488;H01L21/58 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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