SEMICONDUCTOR DEVICE

摘要

A semiconductor device wherein a plurality of semiconductor chips are stacked is provided. In the semiconductor device, mixing of noise from a noise generating circuit to a circuit which easily receives noise is eliminated through a wire. On a semiconductor chip (3) in the semiconductor device, a semiconductor chip (4) is stacked in a region where no noise generating circuit (DC/DC converter circuit (3a)) is arranged in the semiconductor chip (3), and a wire of a circuit (PLL circuit (4a)) which easily receives noise in the semiconductor chip (4) is arranged not to traverse over the noise generating circuit.