Systems and methods of automatically detecting failure patterns for semiconductor wafer fabrication processes

摘要

A system and method of automatically detecting failure patterns for a semiconductor wafer process is provided. The method includes receiving a test data set collected from testing a plurality of semiconductor wafers, forming a respective wafer map for each of the wafers, determining whether each respective wafer map comprises one or more respective objects, selecting the wafer maps that are determined to comprise one or more respective objects, selecting one or more object indices for selecting a respective object in each respective selected wafer map, determining a plurality of object index values in each respective selected wafer map, selecting an object in each respective selected wafer map, determining a respective feature in each of the respective selected wafer, classifying a respective pattern for each of the respective selected wafer maps and using the respective wafer fingerprints to adjust one or more parameters of the semiconductor fabrication process.

主权项

1. A method of fabricating semiconductor wafers using automatically detected failure patterns, comprising:
forming respective wafer fingerprints by selecting a respective object of one or more objects in a respective wafer map of a plurality of wafer maps; determining a respective feature in each of the respective wafer maps using the respective selected object, classifying a respective pattern for each of the respective wafer maps using the respective determined feature and stored pattern information, and identifying a semiconductor wafer fabrication process or tool requiring adjustment using the respective wafer fingerprints formed for each of the plurality of wafer maps, wherein at least one of the forming, determining, classifying and identifying steps is performed by a computer.