摘要 |
A patch packaging apparatus and method. The patch packaging method comprises: a sucking mechanism (10) sucks up a loaded cover (520); the sucking mechanism (10), carrying the cover (520), moves in the direction of an accommodating cavity (22) of a packaging mechanism (20), a substrate (540) to be patched being placed in the accommodating cavity (22); the sucking mechanism (10) places the cover (520) in the accommodating cavity (22), the cover (520), the substrate (540), and the side wall of the accommodating cavity (22) forming a sealed cavity; by means of an air extraction hole arranged in the side wall, an air extraction mechanism (30) extracts the air from the sealed cavity; by means of an aeration hole arranged in the side wall, an aeration mechanism (40) pumps into the sealed cavity a light gas having a lower density than air; and a pressing mechanism (60) presses together the sealed cavity such that, after the light gas has been discharged, the cover (520) is entirely pressed onto the substrate (540). |
申请人 |
BOE TECHNOLOGY GROUP CO., LTD.;HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. |
发明人 |
JING, Yangkun;LIU, Qing;LI, Liangshi;YANG, Jiakai;MA, Guanghe |