发明名称 PATCH PACKAGING APPARATUS AND METHOD
摘要 A patch packaging apparatus and method. The patch packaging method comprises: a sucking mechanism (10) sucks up a loaded cover (520); the sucking mechanism (10), carrying the cover (520), moves in the direction of an accommodating cavity (22) of a packaging mechanism (20), a substrate (540) to be patched being placed in the accommodating cavity (22); the sucking mechanism (10) places the cover (520) in the accommodating cavity (22), the cover (520), the substrate (540), and the side wall of the accommodating cavity (22) forming a sealed cavity; by means of an air extraction hole arranged in the side wall, an air extraction mechanism (30) extracts the air from the sealed cavity; by means of an aeration hole arranged in the side wall, an aeration mechanism (40) pumps into the sealed cavity a light gas having a lower density than air; and a pressing mechanism (60) presses together the sealed cavity such that, after the light gas has been discharged, the cover (520) is entirely pressed onto the substrate (540).
申请公布号 WO2016177295(A1) 申请公布日期 2016.11.10
申请号 WO2016CN80632 申请日期 2016.04.29
申请人 BOE TECHNOLOGY GROUP CO., LTD.;HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. 发明人 JING, Yangkun;LIU, Qing;LI, Liangshi;YANG, Jiakai;MA, Guanghe
分类号 H01L51/56 主分类号 H01L51/56
代理机构 代理人
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