| 摘要 |
The invention relates to a method for coating a surface (101) of an EUV submodule (120, 130) of ceramic material (100) that is intended for use in an EUV lithography system (500). Firstly, metallic solder (114) is applied to the surface (101) of the ceramic substrate (100) over its full surface area. Then a thermal treatment is performed for producing a material bond (116) between the ceramic material (100) and the metallic solder (114). The invention also relates to a method for producing an EUV module (200). For this purpose, at least two EUV submodules (120, 130) respectively coated over their full surface area by the method described above are joined by soldering or adhesive bonding. The invention relates furthermore to an EUV submodule (120, 130), to an EUV module (200) and to an EUV lithography system. |
