发明名称 |
SYSTEM AND METHOD FOR POLISHING SUBSTRATE |
摘要 |
Polishing systems and methods for polishing a substrate are provided. The polishing system includes a polishing assembly having a platen and a polishing pad over the platen. The polishing system also includes a substrate carrying assembly configured to engage a substrate to the polishing pad. The polishing system further includes a thickness sensing assembly configured to monitor a thickness of the polishing pad. |
申请公布号 |
US2016346899(A1) |
申请公布日期 |
2016.12.01 |
申请号 |
US201514725367 |
申请日期 |
2015.05.29 |
申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd |
发明人 |
LAI Jiun-Yu;TSAI Ying-Hsiu;CHANG Wei-Chen;CHIOU Yi-Ching |
分类号 |
B24B49/10;H01L21/67;B24B53/017;H01L21/306;B24B37/005;B24B37/04 |
主分类号 |
B24B49/10 |
代理机构 |
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代理人 |
|
主权项 |
|
地址 |
Hsin-Chu TW |