| 发明名称 |
THERMAL SINK SYSTEMS FOR COOLING A MOLD ASSEMBLY |
| 摘要 |
An example thermal sink system includes a quench plate having an upper surface for receiving a mold assembly to be cooled. A thermal fluid is in thermal communication with the mold assembly via conduction through the quench plate. The quench plate prevents the thermal fluid from contacting the mold assembly. |
| 申请公布号 |
US2016346835(A1) |
申请公布日期 |
2016.12.01 |
| 申请号 |
US201414889260 |
申请日期 |
2014.12.02 |
| 申请人 |
HALLIBURTON ENERGY SEVICES, INC. |
发明人 |
Ownby Clayton Arthur;Cook, III Grant O.;Thomas Jeffrey G.;Propes Cristopher Charles |
| 分类号 |
B22D30/00;F28F25/06;F28F13/02;F28F13/12;B22D27/04;F28D15/00 |
主分类号 |
B22D30/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A thermal sink system, comprising:
a quench plate having an upper surface for receiving a mold assembly to be cooled; and a thermal fluid in thermal communication with the mold assembly via conduction through the quench plate, wherein the quench plate interposes the thermal fluid and the mold assembly and thereby prevents the thermal fluid from contacting the mold assembly. |
| 地址 |
Houston TX US |
