发明名称 |
Techniques for Spin-on-Carbon Planarization |
摘要 |
Systems and methods for SOC planarization are described. In an embodiment, an apparatus for SOC planarization includes a substrate holder configured to support a microelectronic substrate. Additionally, the apparatus may include a light source configured to emit ultraviolet (UV) light toward a surface of the microelectronic substrate. In an embodiment, the apparatus may also include an isolation window disposed between the light source and the microelectronic substrate. Also, the apparatus may include a gas distribution unit configured to inject gas in a region between the isolation window and the microelectronic substrate. Furthermore, the apparatus may include an etchback leveling component configured to reduce non-uniformity of a UV light treatment of the microelectronic substrate. |
申请公布号 |
WO2016196739(A1) |
申请公布日期 |
2016.12.08 |
申请号 |
WO2016US35438 |
申请日期 |
2016.06.02 |
申请人 |
TOKYO ELECTRON LIMITED;TOKYO ELECTRON U.S. HOLDINGS, INC. |
发明人 |
HOOGE, Joshua S.;RATHSACK, Benjamen M.;CARCASI, Michael A.;SOMERVELL, Mark H.;BROWN, Ian J.;PRINTZ, Wallace P. |
分类号 |
H01L21/027;H01L21/02;H01L21/28;H01L21/311;H01L21/762 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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