PANEL LEVEL FABRICATION OF PACKAGE SUBSTRATES WITH INTEGRATED STIFFENERS

摘要

PROBLEM TO BE SOLVED: To provide techniques of forming package substrates with integrated stiffeners.SOLUTION: A panel of package substrates are provided. An adhesion layer is then formed on each package substrate of the panel of package substrates. A panel of stiffeners is then attached to the panel of package substrates by the adhesion layer, the stiffeners corresponding to respective package substrates. The panel of package substrates is then singulated into individual package substrates with integrated stiffeners. The stiffeners on the singulated package substrates include tabs that extend to edges of the package substrates.SELECTED DRAWING: Figure 4A