| 摘要 |
A bonded printhead assembly comprising at least one printhead integrated circuit having a plurality of etched ink supply channels defined in a first bonding surface thereof each ink supply channel extending longitudinally along said first bonding surface a molded ink manifold having a second bonding surface and an adhesive tape sandwiched between the first bonding surface and the second bonding surface said adhesive tape having a plurality of ink supply apertures defined therein.
|
