| 摘要 |
The present invention provides a process for producing a light-emitting device capable of achieving high directivity without a cavity, which minimizes occurrence of short circuit at a time of covering a light-emitting element with glass. The present invention further provides a light-emitting device capable of achieving high directivity without a cavity. After a LED mounted on a wiring board is prepared, a glass member having a shape approximated by a rectangular solid or a sphere is placed on the LED. In this step, the glass member is placed so that the central axis of the glass member placed on the LED is present in a region from the central axis of LED to a position inside from the periphery of LED, and that the area of the region is at most 90% of the area of entire surface on which the glass member is placed. Thereafter, the glass member is softened by a heat treatment to cover the LED with the glass member so that a shape that the central axis of LED substantially agrees with the central axis of the glass member in a self-alignment manner.
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