| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck device, newly structured, which can reduce an in-plane temperature difference of a wafer.SOLUTION: An electrostatic chuck device comprises: an electrostatic chuck portion that has a placement surface for placing a plate-like sample on one main surface and comprises an electrode for electrostatic attraction; a base portion for temperature adjustment which is arranged at an opposite side of the placement surface relative to the electrostatic chuck portion and cools the electrostatic chuck portion; and a heater 50A that is arranged in a layer shape between the electrostatic chuck portion and the base portion for temperature adjustment or inside the electrostatic chuck portion. The base portion for temperature adjustment has a plurality of penetration holes penetrated in a thickness direction. The heater 50A has: a plurality of first members 51A that are belt-like members arranged in a circular area, have circular arc shapes and extend in a circumference direction of the circular area in a planar view; and a second member 52A that extends in a radial direction of the circular area and connects two first members 51A. The second member 52A, which overlaps planarly with a set hole 21, of the heater 50A is set to be wider than the first members 51A.SELECTED DRAWING: Figure 5 |
