| 摘要 |
PROBLEM TO BE SOLVED: To provide a clip structure for a heat sink that enables the heat sink to be set while biasing the heat sink relative to a semiconductor package by using a spring and enables easy detachment of the heat sink.SOLUTION: A mechanism comprises: support members 5 each fixed to the peripheral edge of a semiconductor package disposed on a printed circuit board 2; a heat sink 4 nipped by the plurality of support members; and leaf spring members 6 each fitted into a clearance between a leaf spring member lock portion provided on the tip side of the support member and an upper surface of the heat sink in the compression state with the heat sink nipped by the plurality of support members. The support member has a vertical plate portion extending vertically relative to the printed circuit board, and the leaf spring member is constituted by appropriately cutting off inside of a strip-like flat plate to form a through hole and then, folding the flat plate to have a bellows shape. The leaf spring member lock portion and the vertical plate portion of the support member are inserted through the through hole.SELECTED DRAWING: Figure 1 |
