OLED PACKAGE STRUCTURE AND PACKAGE METHOD THEREOF

摘要

The present invention provides an OLED package structure and package method thereof, and the structure comprises a package cover plate (1), a substrate (2), oppositely positioned with the package cover plate (1), an OLED element (21), positioned between the package cover plate (1) and the substrate (2) and set on the substrate (2), dryer (12), positioned at periphery of the OLED element (21) between the package cover plate (1) and the substrate (2), seal (13), positioned at periphery of the dryer (12) to bond the package cover plate (1) and the substrate (2) and frit glass (11), located at periphery of the seal (13) to bond the package cover plate (1) and the substrate (2); the structure utilizes the seal and the frit glass together to implement the package to make the package structure possess well tightness and mechanical strength at the same time, and meanwhile, the dryer filler is located at the periphery of the OLED element, which applies to the OLED element packages of both top emitting type and bottom emitting type.

主权项

1. An OLED package structure, comprising a package cover plate, a substrate, oppositely positioned with the package cover plate, an OLED element, positioned between the package cover plate and the substrate and set on the substrate, dryer, positioned at periphery of the OLED element between the package cover plate and the substrate, seal, positioned at periphery of the dryer to bond the package cover plate and the substrate and frit glass, located at periphery of the seal to bond the package cover plate and the substrate.