SEMICONDUCTOR DEVICE

摘要

A semiconductor device includes a pad group including pads provided on a semiconductor substrate and arranged in a row to form a pad row as a whole. The pad group includes at least one first pad provided with a first via-connection part electrically connected therewith and extending in a first direction perpendicular to a row direction of the pad row, and at least one second pad provided with a second via-connection part electrically connected therewith and extending in a second direction opposite to the first direction. The at least one second pad is formed at a position moved in the first direction from the row direction of the pad row passing through a center of the at least one first pad.

主权项

1. A semiconductor device comprising:
at least one pad group including a plurality of pads provided on a semiconductor substrate and arranged in a row to form a pad row as a whole, wherein said pad group includes: a plurality of first pads provided with a first via-connection part electrically connected therewith; and a plurality of second pads provided with a second via-connection part electrically connected therewith; said plurality of first pads are positioned so that each center point of said plurality of first pads is arranged along a first center line, said plurality of second pads are positioned so that each center point of said plurality of second pads is arranged along a second center line, said first via-connection part extends in a first direction perpendicular to the first center line, said second via-connection part extends in a second direction opposite to the first direction, the first and second center lines are positioned in parallel with each other and apart from each other, and said first and second via-connection parts are connected to a circuit block provided in said semiconductor substrate.