SEAL RING STRUCTURE TO AVOID DELAMINATION DEFECT

摘要

A semiconductor device includes a semiconductor substrate, a plurality of integrated circuit devices on the semiconductor substrate, and a seal ring structure surrounding each one of the integrated circuit devices. The seal ring structure includes a plurality of interlayer dielectric layers and a plurality of hollow through-hole structures disposed within each of the interlayer dielectric layers. Each of the hollow through-hole structure within an interlayer dielectric layer includes a through-hole disposed within one of the interlayer dielectric layers, a diffusion barrier layer formed at the bottom, sidewalls and the top of the through-hole, and a seed layer disposed on the diffusion barrier layer. The diffusion barrier layer and the seed layer cover the top of the through-hole so that the through-hole has a void to form the hollow through-hole structure.

主权项

1. A semiconductor device comprising:
a semiconductor substrate; a plurality of integrated circuit (IC) devices on the semiconductor substrate; and a seal ring structure surrounding each one of the integrated circuit devices, the seal ring structure comprising a plurality of interlayer dielectric layers and a plurality of hollow through-hole structures disposed within each of the interlayer dielectric layers.