| 发明名称 |
ELECTROSTATIC PUCK ASSEMBLY WITH METAL BONDED BACKING PLATE FOR HIGH TEMPERATURE PROCESSES |
| 摘要 |
An electrostatic puck assembly includes an upper puck plate, a lower puck plate and a backing plate. The upper puck plate comprises AlN or Al2O3 and has a first coefficient of thermal expansion. The lower puck plate comprises a material having a second coefficient of thermal expansion that approximately matches the first coefficient of thermal expansion and is bonded to the upper puck plate by a first metal bond. The backing plate comprises AlN or Al2O3 and is bonded to the lower puck plate by a second metal bond. |
| 申请公布号 |
US2016343600(A1) |
申请公布日期 |
2016.11.24 |
| 申请号 |
US201514830389 |
申请日期 |
2015.08.19 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
Parkhe Vijay D. |
| 分类号 |
H01L21/683;H01L21/67;H01J37/32 |
主分类号 |
H01L21/683 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electrostatic puck assembly comprising:
an upper puck plate comprising AlN or Al2O3 and having a first coefficient of thermal expansion, the upper puck plate further comprising one or more heating elements and one or more electrodes to electrostatically secure a substrate; a lower puck plate bonded to the upper puck plate by a first metal bond, the lower puck plate comprising material having a second coefficient of thermal expansion that approximately matches the first coefficient of thermal expansion; and a backing plate bonded to the lower puck plate by a second metal bond, the backing plate comprising AlN or Al2O3. |
| 地址 |
Santa Clara CA US |
