发明名称 Circuit board for secondary battery and secondary battery with the circuit board
摘要 A secondary battery and to a circuit board for the secondary battery. The circuit board having a structure for enhancing the safety of a secondary battery, and a secondary battery with the same. The circuit board for a secondary battery includes an insulation layer, a terminal pad layer formed on the insulation layer, and a plating layer formed on the terminal pad layer. The thickness of the plating layer is greater than 20 micrometers. The plating layer is made of nickel. The secondary battery further includes a circuit protection device, and a bare cell electrically connected to the circuit protection device, wherein circuit protection device including a first lead plate electrically connected to the plating layer of the circuit board, the plating layer of the circuit board being made of the same material as that of the first lead plate of the circuit protection device.
申请公布号 US9345146(B2) 申请公布日期 2016.05.17
申请号 US200912591549 申请日期 2009.11.23
申请人 Samsung SDI Co., Ltd. 发明人 Kim Bongyoung
分类号 H01M14/00;H05K1/00;H05K1/09;H05K3/24;H01M2/26;H05K3/32;H05K3/06;H05K3/28;H01M10/42;H05K3/00 主分类号 H01M14/00
代理机构 代理人 Bushnell, Esq. Robert E.
主权项 1. A circuit board for a secondary battery, comprising: an insulation layer having a first surface and a second surface opposite to the first surface, the first surface being adjacent to and spaced apart from the secondary battery; a terminal pad layer formed on the first surface of the insulation layer; an external terminal formed on the second surface of the insulation layer; and a plating layer formed on the terminal pad layer, the plating layer being made of nickel, the terminal pad layer being formed of a copper foil and being a portion of a wire pattern, and a photo solder resist (PSR) layer printed to cover the terminal pad layer except a portion of the terminal pad layer spaced apart from edges of the terminal pad layer and the portion having a surface opposite to the first surface of the insulation layer, and the plating layer is formed on the portion of the terminal pad layer not covered by the PSR layer, the plating layer contacting a first lead plate of a circuit protection device including a second lead plate disconnected from the insulation layer and the second lead plate facing outside of the secondary battery through a through-hole.
地址 Giheung-gu, Yongin-si, Gyeonggi-do KR