发明名称 PHOTOELECTRIC COMPOSITE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a photoelectric composite substrate which has high adhesion between a polyimide film with metal wiring formed thereon and an optical waveguide. SOLUTION: This photoelectric composite substrate 1 contains a film-like optical waveguide 4 containing a core portion 8 and cladding layers 7, 9, and the polyimide film 5 with the metal wiring 6 formed on one side. The film-like optical waveguide 4 and the polyimide film 5 are laminated through an adhesive layer 3 so that the surface on which the metal wiring 6 of the polyimide film 5 is formed may face at least one outer surface of the film-like optical waveguide 4. The adhesive layer 3 includes (A) a polyimide silicone resin which has a specific structure, (B) a compound containing at least two oxiranyl groups, and (D) a cured radiation curable composition containing a cationic photopolymerization initiator. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009086058(A) 申请公布日期 2009.04.23
申请号 JP20070252774 申请日期 2007.09.27
申请人 JSR CORP 发明人 KOUHO TAKASHI;TATARA AKITSUGU;HASHIGUCHI YUICHI
分类号 G02B6/122;C09J179/08;C09J183/10 主分类号 G02B6/122
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