发明名称 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
摘要 A nonvolatile semiconductor memory device, includes: a stacked structural unit including a plurality of insulating films alternately stacked with a plurality of electrode films in a first direction; a selection gate electrode stacked on the stacked structural unit in the first direction; an insulating layer stacked on the selection gate electrode in the first direction; a first semiconductor pillar piercing the stacked structural unit, the selection gate electrode, and the insulating layer in the first direction, a first cross section of the first semiconductor pillar having an annular configuration, the first cross section being cut in a plane orthogonal to the first direction; a first core unit buried in an inner side of the first semiconductor pillar, the first core unit being recessed from an upper face of the insulating layer; and a first conducting layer of the first semiconductor pillar provided on the first core unit to contact the first core unit.
申请公布号 US2016190152(A1) 申请公布日期 2016.06.30
申请号 US201615064270 申请日期 2016.03.08
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 FUKUZUMI Yoshiaki;KATSUMATA Ryota;KITO Masaru;KIDOH Masaru;TANAKA Hiroyasu;KOMORI Yosuke;ISHIDUKI Megumi;MATSUNAMI Junya;FUJIWARA Tomoko;AOCHI Hideaki;KlRISAWA Ryouhei;MIKAJIRI Yoshimasa;OOTA Shigeto
分类号 H01L27/115 主分类号 H01L27/115
代理机构 代理人
主权项 1. A nonvolatile semiconductor memory device, comprising: a stacked structural unit including a plurality of insulating films alternately stacked with a plurality of electrode films in a first direction; a selection gate electrode stacked on the stacked structural unit in the first direction; an insulating layer stacked on the selection gate electrode in the first direction; a first semiconductor pillar piercing the stacked structural unit, the selection gate electrode, and the insulating layer in the first direction, a first cross section of the first semiconductor pillar having an annular configuration, the first cross section being cut in a plane orthogonal to the first direction; a first core unit buried in an inner side of the first semiconductor pillar, the first core unit being recessed from an upper face of the insulating layer; and a first conducting layer of the first semiconductor pillar provided on the first core unit to contact the first core unit.
地址 Minato-ku JP