发明名称 |
METHOD AND SYSTEM FOR RESOLVING HOT SPOTS IN LIT |
摘要 |
Localizing hot spots in multi layered device under test (DUT) by using lock-in thermography (LIT) where plural hot spots of electrical circuits are buried in the DUT at different depth layers from a bottom layer to a top layer, comprises applying test signals of multiple frequencies to the electrical circuits of the DUT for exciting the hot spots; imaging a top surface of the top layer of the DUT at timed intervals to obtain IR images of the DUT while the test signal is applied to the electrical circuits wherein the images are in correlation to a propagation of heat from the hot spots in the DUT; detecting the thermal response signals at the timed intervals from the images taken from the DUT; and determining changes in the appearance of hot spot images on the top surface of the DUT in relation to the frequencies of the thermal response signals. |
申请公布号 |
US2016245860(A1) |
申请公布日期 |
2016.08.25 |
申请号 |
US201414913961 |
申请日期 |
2014.08.22 |
申请人 |
DCG Systems, Inc. |
发明人 |
Schmidt Christian |
分类号 |
G01R31/308 |
主分类号 |
G01R31/308 |
代理机构 |
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代理人 |
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主权项 |
1. A method for localizing hot spots in a multi layered device under test (DUT) by using lock-in thermography (LIT) where plural hot spots of electrical circuits are buried in the DUT at different depth layers from a bottom layer to a top layer, comprising:
applying test signals of multiple frequencies to the electrical circuits of the DUT for exciting the hot spots; imaging a top surface of the top layer of the DUT at timed intervals to obtain IR images of the DUT while the test signal is applied to the electrical circuits, wherein the images are in correlation to a propagation of heat from the hot spots in the DUT; detecting the thermal response signals at the timed intervals from the images taken from the DUT; and determining changes in the appearance of hot spot images on the top surface of the DUT in relation to the frequencies of the test signals. |
地址 |
Fremont CA US |