UPPER DOME TEMPERATURE CLOSED LOOP CONTROL

摘要

A method and apparatus for controlling the temperature in a processing chamber for semiconductor processing is disclosed herein. In one embodiment, a processing chamber for semiconductor processing is provided. The processing chamber includes a chamber body and a temperature control system. The temperature control system includes a temperature sensor configured to measure a temperature in an upper dome of the processing chamber, a blower, and a controller configured to control the temperature control system. The temperature control system is configured to carry out the method provided herein for controlling the temperature in a processing chamber.

主权项

1. A processing chamber for semiconductor processing, the processing chamber comprising:
a chamber body comprising:
an upper dome;a lower dome, the upper dome and the lower dome defining an interior volume of the processing chamber; and a temperature control system comprising:
a temperature sensor to measure a temperature of the upper dome;a blower; anda controller in communication with the blower and the temperature sensor.