发明名称 FLUID EJECTION DEVICE FOR DEPOSITING A DISCRETE QUANTITY OF FLUID ONTO A SURFACE
摘要 A fluid ejection device includes a body defining an interior bore, a fluid reservoir, and a fluid ejection chip. The fluid reservoir defines an interior passage that receives a fluid, the interior passage in fluid communication with the interior bore of the body. The fluid ejection chip is coupled with the body and includes one or more fluid ejection actuators. The fluid ejection chip has one or more interior fluid paths in fluid communication with the interior bore of the body so that the fluid ejection chip ejects the fluid upon activation of the one or more fluid ejection actuators. The interior passage of the fluid reservoir and the one or more interior fluid paths are substantially devoid of obstructions such that the fluid is gravity fed to the fluid ejection chip upon entry into the interior passage of the fluid reservoir.
申请公布号 US2016288501(A1) 申请公布日期 2016.10.06
申请号 US201514672688 申请日期 2015.03.30
申请人 Funai Electric Co., Ltd. 发明人 Norasak Sam
分类号 B41J2/14;B41J2/16 主分类号 B41J2/14
代理机构 代理人
主权项 1. A fluid ejection device comprising: a body defining an interior bore; a fluid reservoir having an opening that receives a predetermined, discrete quantity of fluid, the fluid reservoir defining an interior passage that receives the fluid, the interior passage in fluid communication with the interior bore of the body; and a fluid ejection chip coupled with the body and comprising one or more fluid ejection actuators, the fluid ejection chip having one or more interior fluid paths in fluid communication with the interior bore of the body so that the fluid ejection chip ejects the fluid upon activation of the one or more fluid ejection actuators; wherein the interior passage of the fluid reservoir, the interior bore of the body, and the one or more interior fluid paths are substantially devoid of obstructions such that the fluid is gravity fed to the fluid ejection chip upon entry into the interior passage of the fluid reservoir.
地址 Osaka JP