发明名称 POWER APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a power apparatus capable of positioning a terminal of a power semiconductor element while eliminating the need for a positioning jig, and also capable of positioning a body part of the power semiconductor element.SOLUTION: A power apparatus 100 includes: a mold component 1 placed while facing a reverse side 14 toward the power apparatus 100 body, and a front side 11 toward an electronic circuit board 5, a plurality of recesses 15 provided in the reverse side 14 of the mold component 1, and power semiconductor elements 2 placed in respective recesses 15 and abutting against the housing 4. A terminal 23 of the power semiconductor elements 2 is passed through a first hole 18 penetrating the bottom of the recess 15 and connected electrically with the electronic circuit board 5. A body part 21 of the power semiconductor elements 2 is positioned by the recess 15, and the terminal 23 of the power semiconductor elements 2 is positioned by the first hole 18.SELECTED DRAWING: Figure 1
申请公布号 JP2016220470(A) 申请公布日期 2016.12.22
申请号 JP20150105554 申请日期 2015.05.25
申请人 MITSUBISHI ELECTRIC CORP 发明人 KUREISHI YOSHIO
分类号 H02M3/00;H01L23/32;H01L25/07;H01L25/18;H02M7/12;H02M7/48;H05K1/18 主分类号 H02M3/00
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