| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which one electrode of a semiconductor chip is electrically connected with a plurality of terminals or electrodes. <P>SOLUTION: A semiconductor device related to the present invention is the semiconductor device with a semiconductor chip 1 connected onto a frame 4 by a flip chip, and is provided with: a terminal 3a and a terminal that are formed on or at the upper part of the frame; a bonding wire 5 for electrically connecting the terminal 3a and the terminal with a first bonding point formed at the terminal 3a and a second bonding point formed at the terminal; and a bump 2 that is formed on the active side of the semiconductor chip 1. At the first bonding point, a recessed part 5a comprising a part of the bonding wire 5 is formed, and the bump 2 is bonded to the recessed part 5a. <P>COPYRIGHT: (C)2008,JPO&INPIT |
