| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric module excellent in reliability by obtaining a substrate for thermoelectric modules enhancing reliability owing to stress relaxation or the like without impairing a function as a thermoelectric module such as thermal conductivity, and by using such a substrate. SOLUTION: The substrate for thermoelectric modules 11, 12 comprises: a synthetic resin layer containing a filler having advantageous thermal conductivity; and a copper layer composed of a copper-metalized layer or a copper plate (11a, 11b, 12a, 12b) which is formed on a single or both surface(s) of the synthetic resin layer, wherein the substrate is characterized in that the substrate is formed so that when the volume content of the filler in the synthetic resin layer, the thickness of the synthetic resin layer and the total thickness of the copper layer respectively are denoted by A(%), B (μm) and C (μm), these factors satisfy relations of: (C/4)-B≤65, A/B≤3.5, A>0, C>50 and B≥7. COPYRIGHT: (C)2009,JPO&INPIT |
