| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly-reliable semiconductor laser module which can make it hard to cause peeling of a resin for fixing an optical fiber in a simple structure.SOLUTION: A semiconductor laser module 1 comprises a bottom plate 11, a semiconductor laser element 22 arranged on the bottom plate 11, an optical fiber 30 which transmits the laser beam emitted from the semiconductor laser element 22, a fiber mount 40 protruding from an upper surface 11A of the bottom plate 11, and a resin 50 for fixing the optical fiber 30 onto the fiber mount 40. The resin 50 is formed so as to cover the side surfaces 42A, 42B,43A, and 43B of the fiber mount 40.SELECTED DRAWING: Figure 2 |
