| 发明名称 |
COOLING MODULE |
| 摘要 |
A cooling module is configured to cool an electronic component installed in a chassis. The cooling module includes a radiator configured to absorb heat of the electronic component, a fan module, and a heat dissipating member. The heat dissipating member includes an absorption end fixed on the radiator and a radiating end covered on the fan module. The absorption end is configured to absorb the heat of the radiator and transfer to the radiating end. The fan module is configured to drive airflow through the heat dissipating member to dissipate the heat of the heat dissipating member to cool the electronic component. |
| 申请公布号 |
US2016234965(A1) |
申请公布日期 |
2016.08.11 |
| 申请号 |
US201514695605 |
申请日期 |
2015.04.24 |
| 申请人 |
HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD. ;HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
WANG HAI-YUN |
| 分类号 |
H05K7/20;G06F1/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A cooling module comprising:
a radiator configured to absorb heat of an electronic component installed in a chassis; and a heat dissipating member comprising an absorption end fixed on the radiator and a radiating end covering a fan module configured to cool the radiating end; wherein the absorption end is configured to absorb the heat and transfer to the radiating end. |
| 地址 |
Wuhan CN |
