Bi-BASED SOLDER ALLOY, METHOD OF BONDING ELECTRONIC COMPONENT USING THE SAME, AND ELECTRONIC COMPONENT-MOUNTED BOARD

摘要

Provided is a Bi-based solder alloy containing a specific amount of Al in Bi—Ag and having particles including a Ag—Al intermetallic compound dispersed therein, a method of bonding a Ag-plated electronic component, a bare Cu frame electronic component, an Ni-plated electronic component, or the like using the same, and an electronic component-mounted board.;A Bi-based solder alloy includes Ag and Al, is substantially free of Pb, and has a Bi content of 80 mass % or more, a solidus of a melting point of 265° C. or more, and a liquidus of 390° C. or less. A content of Ag is 0.6 to 18 mass %, a content of Al is 0.1 to 3 mass %, the content of Al is 1/20 to 1/2 of the content of Ag, and particles including a Ag—Al intermetallic compound are dispersed in the solder alloy.

主权项

1. A Bi-based solder alloy that comprises Ag and Al, is substantially free of Pb, and has a Bi content of 80 mass % or more, a solidus of a melting point of 265° C. or more, and a liquidus of 390° C. or less, wherein
a content of Ag is 0.6 to 18 mass %, a content of Al is 0.1 to 3 mass %, the content of Al is 1/20 to 1/2 of the content of Ag, and particles comprising a Ag—Al intermetallic compound are dispersed in the solder alloy.