ELECTRODE BONDING APPARATUS AND ELECTRODE BONDING METHOD

摘要

The present invention has an object to provide an electrode bonding apparatus that performs ultrasonic vibration bonding on points of an electrode and is capable of reducing variations in a peel force among the points even when the electrode is bonded onto the substrate at a lower peel force. According to the present invention, a collecting electrode (20A, 20B) is disposed along a side (L1, L2) of a glass substrate (1) on a solar cell (ST1). Then, the glass substrate is pressed along the side in a region of the glass substrate between the side and an arrangement position of the collecting electrode. During application of the pressure, the ultrasonic vibration bonding is performed on the collecting electrode using an ultrasonic vibration tool (14).

主权项

1. An electrode bonding apparatus (100) that bonds an electrode (20A, 20B) onto a substrate (1) on which a solar cell (ST1) is formed, along a side (L1, L2) of the substrate, the substrate being rectangular, said electrode bonding apparatus comprising:
a table (11) on which the substrate is mounted; an ultrasonic vibration tool (14) that performs ultrasonic vibration bonding on the electrode disposed along the side, on the solar cell; and two pressure parts (12A) that press the substrate, said pressure parts being vertically movable, wherein the substrate has a first side (L1), and a second side (L2) facing the first side, one of said pressure parts presses the substrate along the first side, in a first predetermined region of the substrate between the first side and an arrangement position of the electrode, and the other of said pressure parts presses the substrate along the second side, in a second predetermined region of the substrate between the second side and an arrangement position of the electrode.