METHOD FOR BONDING ELECTRONIC COMPONENT, SOLDER COMPOSITION USED THEREIN, AND PRETREATMENT AGENT

摘要

PROBLEM TO BE SOLVED: To provide a method for bonding an electronic component, by which the shelf life can be improved while keeping the bondability and thermal curability of a solder composition.SOLUTION: A method for bonding an electronic component according to the present invention comprises the steps of: applying a pretreatment agent 3 containing (X) an organic acid to the electronic component 1; applying, to a substrate 2, a solder composition 4 containing (A) solder powder and (B) a flux composition containing a thermosetting resin; and performing a reflow process with the electronic component 1 put on the substrate 2.SELECTED DRAWING: Figure 1