| 摘要 |
A semiconductor device includes a semiconductor body including a first upper surface with a first side surface extending downwardly therefrom, a second upper surface with a second side surface extending downwardly therefrom, and a bottom surface interfacing first and second side surfaces. The first and second side surfaces and the bottom surface together define a groove. A conductive film partially fills the groove with an intervention of an insulating film therebetween so the conductive film terminates at a first intermediate portion of the first side surface between the first upper surface and the bottom surface and at a second intermediate portion of the second side surface between the second upper surface and the bottom surface. A distance between the first intermediate portion of the first side surface and the first upper surface exceeds a distance between the second intermediate portion of the second side surface and the second upper surface. |
