SEMICONDUCTOR DEVICE, RESIN COMPOSITION FOR BUFFER COATING, RESIN COMPOSITION FOR DIE BONDING, AND RESIN COMPOSITION FOR ENCAPSULATION

摘要

Disclosed is a semiconductor device which is obtained by mounting a semiconductor element coated with a cured product of a resin composition for buffer coating on a lead frame by using a cured product of a resin composition for die bonding, and then encapsulating the semiconductor element with a cured product of a resin composition for encapsulation. This semiconductor device is characterized in that the cured product of the resin composition for buffer coating has an elastic modulus at 25°C of not less than 0.5 GPa but not more than 2.0 GPa; the cured product of the resin composition for die bonding has an elastic modulus at 260°C of not less than 1 MPa but not more than 120 MPa; and the cured product of the resin composition for encapsulation has an elastic modulus at 260°C of not less than 400 MPa but not more than 1200 MPa and a thermal expansion coefficient at 260°C of not less than 20 ppm but not more than 50 ppm. This semiconductor device is further characterized in that the product of the elastic modulus at 260°C and thermal expansion coefficient at 260°C of the cured product of the resin composition for encapsulation is not less than 8,000 but not more than 45,000.