| 摘要 |
Conventionally, organic semiconductor devices are usually formed by either laser ablation, photolithography or by conductive inkjet printing. All these methods have short coming such as either being unsuitable for high volume production, slow, expensive or as is particularly the case in inject printing, the choice of metals used is restricted to those which can be formed as inks. The present invention employs flexography to print a resist pattern (7) onto a substrate (5) carrying a metal layer (8). Metal not protected by the resist can be etched away and then the resist (7) removed to leave exposed electrodes. Further materials (10,11) can be disposed onto the exposed metal, such as organic semiconductors, to form transistors or diodes. |
