| 摘要 |
PROBLEM TO BE SOLVED: To provide a means which prevents a liquid-like sealing resin from flowing out without functionally damaging an upper exposed surface wherein a sensor and an MEMS are formed by performing resin sealing for only an electrical connection part of the upper exposed surface of a semiconductor chip. SOLUTION: A dam beam 5 is disposed having a slight clearance with the surface 2a of a sensor chip 2, and a sealing part 7 is formed by sealing an electrode 2b formation region 2c side by a sealing resin 7a from the dam beam 5. The clearance has a dimension for allowing the flow of the sealing liquid-like resin into the clearance at the formation of the sealing part 7, and is set to a dimension not to allow it to protrude over the dam beam 5 by surface tension between the dam beam 5 and the surface 2a of the sensor chip. Consequently, size reduction is possible without damaging the sensor chip 2. COPYRIGHT: (C)2008,JPO&INPIT |
