发明名称 PIEZOELECTRIC DEVICE AND METHOD OF MANUFACTURING PACKAGE OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a piezoelectric device capable of preventing defective airtightness in a package by preventing the occurrence of a crack in a through hole of the package during seam welding. SOLUTION: In the piezoelectric device provided with a quartz oscillation element 11, a package 2 that is formed by an laminated substrate 20 obtained by laminating a plurality of insulating materials and that has an element mounting connection pad 3 for mounting the quartz oscillation element 11 on the upper surface side of the laminated substrate 20, a through-hole 7 for penetrating the upper and lower surfaces of the package 2, and a lid 6 for airtightly sealing an upper surface side space S of the package 2 which includes the quartz oscillation element 11 electrically connected to the connection pad 3. A metallized portion 24 with a prescribed film thickness and more is formed on an inwall of the through-hole 7 of an insulating substrate 21 located on the lowermost surface side of the laminated substrate 20. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009089215(A) 申请公布日期 2009.04.23
申请号 JP20070258381 申请日期 2007.10.02
申请人 EPSON TOYOCOM CORP 发明人 NAGANO YOJI
分类号 H03H9/02;H01L23/02;H03H3/02 主分类号 H03H9/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利