发明名称
摘要 PROBLEM TO BE SOLVED: To provide a carrier plate for holding a chip that prevents a rubber layer formed on a surface of a metal plate from being separated and floating up.SOLUTION: A carrier plate 200 for holding a chip includes a rubber layer formed on a surface of a metal plate 210. The rubber layer comprises: a top-face rubber layer formed on a top face of the metal plate 210 so as to extend to a marginal end part of the metal plate top face without any remaining marginal part of the metal plate top face; a bottom-face rubber layer formed on a bottom face of the metal plate 210 so as to extend to a marginal end part of the metal plate bottom face without any remaining marginal part of the metal plate bottom face; and a chip holding rubber layer formed inside through-holes to form chip holding holes 240.
申请公布号 JP5526365(B2) 申请公布日期 2014.06.18
申请号 JP20130077910 申请日期 2013.04.03
申请人 发明人
分类号 H01G13/00 主分类号 H01G13/00
代理机构 代理人
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