| 摘要 |
PROBLEM TO BE SOLVED: To provide a carboxyl group-containing photosensitive compound excellent in heat resistance, resistance to heat decomposition and flame retardancy in an obtained cured product; a photosensitive resin; its cured product; a resist material using them; and a method for producing the carboxyl group-containing photosensitive compound.SOLUTION: A carboxyl group-containing photosensitive compound is obtained by allowing an epoxy acrylate compound, obtained by allowing an epoxy compound described below to react with (meth) acrylic acid or its halide, to react with polybasic acid anhydride. The epoxy compound has a diarylene[b,d]furan structure, in which at least one arylene group in the two arylene groups forming the diarylene[b,d]furan structure has a naphthylene skeleton, and each of the two arylene groups has an epoxy group on its aromatic ring.SELECTED DRAWING: None |
