发明名称 THREE-DIMENSIONAL CIRCUIT BOARD AND SOLDER RESIST COMPOSITION USED FOR THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a three-dimensional circuit board having high reliability, which can prevent a solder flow or a short circuit upon mounting a component, and a solder resist composition used for the circuit board.SOLUTION: A three-dimensional circuit board 10 includes a circuit 2 and a component mounting part 3 formed on a three-dimensional substrate 1. A solder resist 4 is formed to open the component mounting part 3, and an electronic component is mounted by soldering in the component mounting part 3. The solder resist 4 is preferably a photoresist; and it is preferable that the three-dimensional substrate 1 is a resin molded article and that the circuit 2 is formed in the resin molded article.SELECTED DRAWING: Figure 1
申请公布号 JP2016139832(A) 申请公布日期 2016.08.04
申请号 JP20160094047 申请日期 2016.05.09
申请人 TAIYO INK MFG LTD 发明人 SHIMAMIYA AYUMI;YONEDA NAOKI;USHIKI SHIGERU
分类号 H05K1/02;H05K3/10;H05K3/24;H05K3/28;H05K3/34 主分类号 H05K1/02
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