发明名称 HALOGEN-FREE RESIN COMPOSITION AND USE THEREOF
摘要 The present invention relates to a halogen-free resin composition, a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises, based on the weight parts of organic solids, (A) from 40 to 80 parts by weight of allyl-modified benzoxazine resin, (B) from 10 to 20 parts by weight of hydrocarbon resin, (C) from 10 to 40 parts by weight of allyl-modified polyphenyl ether resin, (D) from 10 to 20 parts by weight of allyl-modified bismaleimide resin, (E) from 0.01 to 3 parts by weight of an initiator, (F) from 10 to 100 parts by weight of a filler, and (G) from 0 to 80 parts by weight of a phosphorus-containing flame retardant. The prepreg and laminate prepared from the halogen-free resin composition have lower dielectric constant and dielectric loss tangent value, higher peel strength, high glass transition temperature, excellent thermal resistance and better flame retardant effect.
申请公布号 US2016244611(A1) 申请公布日期 2016.08.25
申请号 US201415027353 申请日期 2014.03.21
申请人 SHENGYI TECHNOLOGY CO., LTD. 发明人 Yang Hu;He Yueshan
分类号 C08L79/04;H05K1/02;H05K1/09;C09D179/04;H05K1/03 主分类号 C08L79/04
代理机构 代理人
主权项 1. A halogen-free resin composition based on the weight parts of organic solids, comprising: (A) from about 40 to about 80 parts by weight of allyl-modified benzoxazine resin, (B) from about 10 to about 20 parts by weight of hydrocarbon resin, (C) from about 10 to about 40 parts by weight of allyl-modified polyphenyl ether resin, (D) from about 10 to about 20 parts by weight of allyl-modified bismaleimide resin, and (E) from about 0.01 to about 3 parts by weight of an initiator.
地址 Guangdong CN